Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
Electronics Forum | Mon Feb 20 20:47:59 EST 2006 | davef
We assume your stencil is clean. So, try: * Reduce stencil separation speed. * Reduce squeegee pressure. If the pressure is not proper, excess number of particles are stuffed into an aperture and inner pressure / friction among particles increase, an
Electronics Forum | Mon Jun 19 07:50:03 EDT 2023 | tommy_magyar
What I would ask before actually answering your question is, what is the smallest footprint/pad which can be pressure dispensed/jet printed? Regards, Tom.
Used SMT Equipment | Screen Printers
MPM UP2000HiE PRINTER Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps) Thickness rang
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Parts & Supplies | SMT Equipment
MPM AP series about squeegee pressure Name: P1666; MPMAP series about squeegee pressure control card Part Number: P1666 Description: P1666; MPM AP series about squeegee pressure control card Applicable models: UP; AP Printing Presses P1666;
Parts & Supplies | Screen Printers
Name: P1827 MPM air pressure sensor; MPM APS air pressure switch Part Number: P1827 MPM APS sensor Description: P1827 MPM air pressure sensor; MPM APS air pressure switch; MPM APS sensor; Module, Pneum Electric, Pressure Switch Applicable mod
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Sunnyvale, California USA | Engineering
Our client is a leading equipment supplier to electronic assemblers around the world. Responsibilities: Conduct technical analysis of product implementations, modifications and enhancements to product in accordance with specific customer specifi
Career Center | Rockledge, Florida USA | Purchasing
Primarily responsible for overseeing the purchasing of materials required for production of PCB assemblies. Individual will establish new and alternative supply sources, and negotiate prices and delivery schedules. Individual will communicate with mu
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Over the past decade, depositing adhesives for SMT components
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DEK print machine DEK 145009 265GSX COGNEX VISION CARD dek smt screen printer parts Leave a Message We will call you back soon
KingFei SMT Tech | http://www.smtspare-parts.com/sale-9397852-dek-screen-printing-machine-parts-dek-squeegee-pressure-sensor-183452-0-5kg.html
DEK Screen Printing Machine Parts DEK Squeegee pressure Sensor 183452 0.5KG Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
